In the ever-evolving landscape of engineering education, it is important to understand and invest in the latest technologies to ensure students leave institutions with industry-relevant training and ready for work. Investing in a revolutionary technique to empower students to delve deeper into material behaviour and structural analysis, TecQuipment’s DefleX®, a Digital Image Correlation (DIC) solution, is designed specifically to illuminate the complexities of surface deformations, strains, and displacements in materials and shapes.
Understanding Digital Image Correlation (DIC)
Digital Image Correlation (DIC) is an innovative technique that utilises digital cameras to extract full-field data from images of a specimen's surface during testing. Unlike traditional methods, DIC provides comprehensive insight into material behaviour beyond stress-strain curves, generating full-field strain maps that visualise strain distribution and detect invisible cracks. DIC technology, available in 2D and 3D, offers engineers precise measurements and reliable data for material characterisation and structural validation.
Unlike traditional methods such as extensometers or strain gauges, DIC offers...........
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